BGA chip bonding equipment

Details

The Development Of FPC Industry Technology Is Related To The Development Of Its Application Products. In Recent Years, Traditional FPC Flexible Circuit Boards Have Been Unable To Meet The Requirements Of Light, Thin, Small And Clever Electronic Products. With The Development Of Emerging Electronic Products Such As Smart Wear, Flexible Circuit Boards Are Not Only Smaller, More Conductive And Insulated. Reliability, Heat Resistance, Moisture Resistance, Elastic Modulus, Thickness Uniformity And Other Performance Development, COF (ChiponFlexible Printed Circuit) Flexible Packaging Substrate And Other Products With Better Performance Than Traditional Flexible Circuit Boards Are Driven By The Downstream Market Demand, This It Is Also A Necessity For A Fpc Company To Maintain A Sense Of Innovation At All Times - Hongtai Precision Line Co., Ltd.

Technical Parameters：
Dimensions: 1800*1600*1600 (l*w*h:mm)
X/Y/Z stroke: 600*700*150 (mm)
Vehicle size: (100mm-400mm)
Control mode: industrial computer vision + PLC motion control
Rated power: 2.4KW
Repeatability: 0.005mm
Positioning accuracy: 0.01mm
Minimum flux: 0.004MG (mg)
Maintenance period: 60s/pcs